Speakers

A senior account manager at Pixelligent, where he leads sales and marketing efforts for North America and Europe.

Enabling scalable fabrication of complex microstructures: Dual-Wavelength Micro-Lithography

Innovations in Photomask Production for Enhanced AR/VR Optics

Free-form micro-optics for automotive lighting systems – advancements and challenges from design to integration

Daniele Brunazzo recently joined CSEM in the role of Business Development Manager, with a focus on micro and nano-optics, MEMS, and sensors.

Micro-optics for AR/VR from design to manufacturing

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New capabilities for the cost-effective fabrication of fiber-to-PIC interconnects

Imaging-grade monolithic polymer components for low- to high-volume applications

Empowering Photonics and Micro Optics Innovation via DALP Technology

How microoptics can help making real Light-AR eyewear

Presentation = Scalable nanoimprint solutions for high-volume AR waveguide manufacturing

Presentation = Advancing Consumer Optics with Ultra-Precision Machining

Presentation = Precision 3D Printing for Photonic Integration and Optical Coupling

Presentation = Printed Optics: The Digitization of Custom Optics Fabrication

Applications of Optical Nanostructures for Light Beam Shaping

Precision Roll-to-Roll technology for enhancing consumer products

Michael Hamm earned his physics diploma in 1993, and his doctorate in electrotechnics in 1997 from the University of Darmstadt, Germany.

Efficient, maskless pattern shaping for lighting and projection

AR/VR Design for Enhanced User Experience

Roll-2-roll imprinting solutions in lighting

Advancing Respiratory Diagnostics: Real-Time Ciliary Beat Frequency Analysis with the glass 3D printed imaging bundle

Precision laser microstructuring and texturing for enhanced automotive lighting solutions

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Novel emitter technology and microlenses for novel NDIR schemes.

Innovative nanofabrication for enhanced performance in displays

Test & Validation

Testing and validation in Automotive

Micro lenses for optical interconnects molded in a new reflow resistant EXTEM™ resin (TPI)