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Home Presentations Micro lenses for optical interconnects molded in a new reflow resistant EXTEM™ resin (TPI)
  • Optical communication

Micro lenses for optical interconnects molded in a new reflow resistant EXTEM™ resin (TPI)

Track: Micro-optics in integrated photonics
  • 2024

This presentation talks about materials with high near-IR transparency for typical VCSEL wavelengths that are ideal for molded microlenses for optical interconnects.


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Speaker

Young Joon Choi ()

Lead Scientist at SABIC
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